Inside Intel’s Latest Breakthrough Is Foveros, 3D Stacking Technology

Intel, the world’s largest chip maker recently announced about the CPU architecture “Lakefield” which is built upon Intel’s Sunny Cove microarchitecture with AI and Crypto Acceleration. Sunny Cove is designed to increase performance per clock and power efficiency for general…

Intel Unveils Revolutionary Foveros 3D Chip Stacking, Introduces New 10nm ‘Chiplets’

Intel last week revealed their detailed strategy about how to hold all the data-intensive workloads for devices, networks and cloud data centres. They announced the launch of a revolutionary and industry’s first 3D stacking of logic chips. This stacking will…

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