HCLTech has been selected as a Design Solution Partner (DSP) under the Samsung Advanced Foundry Ecosystem (SAFE™) program. This strategic collaboration aims to accelerate semiconductor innovation by using HCLTech’s extensive expertise in engineering and R&D services and Samsung’s cutting-edge process technologies.
Under the SAFE™-DSP program, HCLTech will offer comprehensive application-specific integrated circuit (ASIC) design services to semiconductor customers looking to utilise Samsung’s advanced manufacturing processes. The partnership is expected to enhance the efficiency of chip design and development, ultimately reducing the time-to-market for new silicon technologies.
Samsung will provide HCLTech employees with specialised training in advanced semiconductor technologies and offer technical support on turnkey projects. Moreover, the collaboration will grant HCLTech access to multi-project Wafer (MPW) programs, facilitating efficient prototyping and production of semiconductor solutions.
Taejoong Song, vice president at Samsung Electronics, said, “This partnership underscores our shared commitment to innovation and excellence, accelerating the development of next-generation silicon solutions.”
Sanjay Gupta, corporate vice president of strategic initiatives at HCLTech, emphasised the rapid growth of the semiconductor industry and the importance of strategic collaborations. “By combining the strengths of HCLTech and Samsung Foundry, we aim to drive advancements in semiconductor technology and meet the evolving demands of the global market,” he said.
Earlier this week, HCLTech partnered with Western Union to improve its financial services by implementing an AI-based platform operating model. This partnership positions HCLTech as Western Union's largest preferred partner, emphasising digital transformation, platform innovation and operational efficiency.
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