TSMC (Taiwan Semiconductor Manufacturing Company), Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. today announced their joint investment in the European Semiconductor Manufacturing Company (ESMC) GmbH, located in Dresden, Germany.
This strategic initiative aims to introduce cutting-edge semiconductor manufacturing capabilities to Europe, setting the stage for future innovation and growth in the automotive and industrial sectors.
The planned joint venture will be 70% owned by TSMC, with Bosch, Infineon, and NXP each holding 10% equity stake, subject to regulatory approvals and other conditions. Total investments are expected to exceed 10 billion euros consisting of equity injection, debt borrowing, and strong support from the European Union and German government. The fab will be operated by TSMC.
TSMC also approved an equity investment of 3.5 billion euros ($3.8 billion) to a European Semiconductor Manufacturing Company (ESMC) GmbH, to provide foundry services
Underpinned by the ambitious European Chips Act, the establishment of ESMC heralds a pivotal advancement in semiconductor manufacturing in Europe. The project envisions the construction of a state-of-the-art 300mm fabrication facility. The anticipated fabrication plant is poised to feature a robust monthly production capacity of 40,000 300mm (12-inch) wafers, leveraging TSMC's acclaimed 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology.
Construction of the facility is slated to commence in the latter half of 2024, with production scheduled to commence by the close of 2027.
TSMC has also committed a substantial $40 billion investment towards establishing a new facility in the western United States, specifically in Arizona. This move aligns with efforts to bolster domestic chip manufacturing in line with Washington's strategic objectives. Moreover, TSMC's global expansion endeavors extend to Japan, where it is collaborating with Sony in the joint venture construction of a new plant.
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