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Tata Electronics to Manufacture Qualcomm’s Automotive Modules in Assam
Tata Electronics to Manufacture Qualcomm’s Automotive Modules in Assam
Assam's Tech Renaissance

Tata Electronics to Manufacture Qualcomm’s Automotive Modules in Assam

The products will support digital cockpits, infotainment, connectivity, and intelligent vehicle systems.

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Key takeaways

  • Tata Electronics partners with Qualcomm to manufacture automotive modules in Assam, boosting local production.
  • Investment of $3 billion supports the Make in India initiative and strengthens supply chain resilience.
  • Facility will produce modules for digital cockpits, infotainment, and intelligent vehicle systems.
  • Collaboration expands Qualcomm's global module manufacturing network, enhancing regional manufacturing capacity.
  • Tata's Integrated Systems Packaging solutions will optimize products for Qualcomm's automotive portfolio.
5 min

Qualcomm Technologies and Tata Electronics have partnered to manufacture Qualcomm’s automotive modules in India. The companies will begin production at Tata Electronics’ semiconductor assembly and test facility (OSAT) in Jagiroad, Assam, as part of the Make in India initiative.

The collaboration involves Tata joining Qualcomm’s global network of module manufacturing partners. The companies said the move will support Indian and global automakers and strengthen supply chain resilience.

Nakul Duggal, EVP and Group GM for Automotive at Qualcomm, said in a statement, “As the industry accelerates its shift toward integrated, module-based architectures, expanding manufacturing capacity in key regions becomes essential.”

The plant is an indigenous OSAT facility and involves an investment of $3 billion. The modules integrate the Snapdragon Digital Chassis system-on-chip (SoC) and key system components into a production-ready unit. The companies said the products will support digital cockpits, infotainment, connectivity, and intelligent vehicle systems.

Randhir Thakur, CEO and MD of Tata Electronics, said the company will leverage its Integrated Systems Packaging (ISP) solutions to deliver products for Qualcomm’s automotive portfolio.

The Assam facility will focus on crucial platform technologies, including wire bonding, flip-chip, and ISP. It will manufacture products for automotive, communications, IoT, and AI applications.