Chennai-headquartered fabless semiconductor company Aheesa Digital Innovations has signed a memorandum of understanding (MoU) with Guidance Tamil Nadu, the state’s investment promotion agency, for its proposed semiconductor design, R&D, and product engineering centre in Chennai.
The proposed facility involves an investment of approximately ₹250 crore and is expected to create more than 300 jobs. The centre will focus on developing networking chips, router operating systems and original equipment manufacturer (OEM) platforms, strengthening Aheesa’s semiconductor design and product engineering capabilities.
The proposed Chennai centre will expand Aheesa’s work across semiconductor design, research and development and product engineering. The company plans to build a portfolio of networking silicon targeting broadband, telecommunications, edge computing, and related infrastructure markets.
Aheesa recently initiated its MPW process for VIHAAN-I, its broadband networking System-on-Chip (SoC) based on the RISC-V architecture.
Under the MoU, the Tamil Nadu government will facilitate the proposed project through infrastructure support, single-window clearances and applicable policy incentives, subject to eligibility.
Saket Singh, Director and Chief Growth Officer, Aheesa Digital Innovations, said: "Tamil Nadu has emerged as one of India's most promising hubs for electronics and semiconductor manufacturing, and this MoU reflects the strong alignment between our vision and the state's ambitions for the sector. As we build out our design, R&D, and product engineering capabilities in Chennai, with this proposed investment of Rs 250 crore expected to create around 300 jobs, the facilitation and support extended by the Government of Tamil Nadu will be a valuable enabler."
The proposed centre is expected to expand Aheesa’s capabilities in networking silicon and support its longer-term ambition of developing semiconductor products for broadband, telecom and edge infrastructure. The investment also adds to Tamil Nadu’s growing push to build capabilities across electronics and semiconductor design and manufacturing.
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