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Aheesa Digital Innovations Signs MoU With Tamil Nadu Govt for ₹250 Cr Semiconductor Design Centre
Aheesa Digital Innovations Signs MoU With Tamil Nadu Govt for ₹250 Cr Semiconductor Design Centre

Aheesa Digital Innovations Signs MoU With Tamil Nadu Govt for ₹250 Cr Semiconductor Design Centre

Aheesa recently initiated its MPW process for VIHAAN-I, its broadband networking System-on-Chip (SoC) based on the RISC-V architecture

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Key takeaways

  • Aheesa Digital Innovations has signed a MoU with the Tamil Nadu government for a semiconductor design centre in Chennai.
  • The proposed facility will require an investment of approximately ₹250 crore and is expected to create over 300 jobs.
  • The centre will enhance Aheesa's capabilities in semiconductor design, R&D, and product engineering, focusing on networking chips and related technologies.
  • Aheesa has initiated the MPW process for its broadband networking System-on-Chip (SoC) based on RISC-V architecture.
  • The Tamil Nadu government will support the project with infrastructure and policy incentives to facilitate its development.
5 min

Chennai-headquartered fabless semiconductor company Aheesa Digital Innovations has signed a memorandum of understanding (MoU) with Guidance Tamil Nadu, the state’s investment promotion agency, for its proposed semiconductor design, R&D, and product engineering centre in Chennai.

The proposed facility involves an investment of approximately ₹250 crore and is expected to create more than 300 jobs. The centre will focus on developing networking chips, router operating systems and original equipment manufacturer (OEM) platforms, strengthening Aheesa’s semiconductor design and product engineering capabilities.

The proposed Chennai centre will expand Aheesa’s work across semiconductor design, research and development and product engineering. The company plans to build a portfolio of networking silicon targeting broadband, telecommunications, edge computing, and related infrastructure markets.

Aheesa recently initiated its MPW process for VIHAAN-I, its broadband networking System-on-Chip (SoC) based on the RISC-V architecture.

Under the MoU, the Tamil Nadu government will facilitate the proposed project through infrastructure support, single-window clearances and applicable policy incentives, subject to eligibility.

Saket Singh, Director and Chief Growth Officer, Aheesa Digital Innovations, said: "Tamil Nadu has emerged as one of India's most promising hubs for electronics and semiconductor manufacturing, and this MoU reflects the strong alignment between our vision and the state's ambitions for the sector. As we build out our design, R&D, and product engineering capabilities in Chennai, with this proposed investment of Rs 250 crore expected to create around 300 jobs, the facilitation and support extended by the Government of Tamil Nadu will be a valuable enabler."

The proposed centre is expected to expand Aheesa’s capabilities in networking silicon and support its longer-term ambition of developing semiconductor products for broadband, telecom and edge infrastructure. The investment also adds to Tamil Nadu’s growing push to build capabilities across electronics and semiconductor design and manufacturing.



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