The Odisha government has announced that Intel Corporation and 3D Glass Solutions (3DGS) have signed a memorandum of understanding (MoU) to explore the establishment of an advanced semiconductor glass core packaging substrate manufacturing facility in the state.
The proposed project, which remains subject to regulatory approvals, funding support from both the state and central governments, and other business conditions, is expected to significantly strengthen India's semiconductor manufacturing ecosystem.
According to the state government, the facility could become one of the largest technology investments in Eastern India and serve as a catalyst for the development of semiconductor manufacturing, advanced packaging, AI infrastructure, next-generation data centres, and digital technologies in the region.
The announcement aligns with Odisha's broader ambition to build a globally competitive semiconductor and digital infrastructure ecosystem under its Vision 2036 roadmap and India's Aatmanirbhar Bharat initiative.
Commenting on the development, Babu Mandava, CEO of 3D Glass Solutions, said, “We are grateful for the strong support of the Odisha government and excited about our collaboration with Intel in exploring this opportunity. This initiative has the potential to establish India as a key global hub for advanced glass substrates and semiconductor packaging, supporting high-growth sectors such as AI, high-performance computing, and next-generation electronics.”
The state government said the initiative represents a strategic opportunity to attract global technology players, research institutions, and industry stakeholders to help build what it describes as one of Asia's most advanced semiconductor and digital infrastructure ecosystems.
Naga Chandrasekaran, Executive Vice President and General Manager, Intel Foundry, said, “Intel Foundry is proud to collaborate with 3DGS in exploring this opportunity with the Odisha government. As a pioneer in glass core substrate technology, we are excited about the potential of this collaboration to accelerate the commercialisation of next-generation advanced packaging solutions globally.”
Highlighting the state's long-term objectives, Mukesh Mahaling, Odisha's Minister for Electronics and Information Technology, Health and Family Welfare, and Parliamentary Affairs, said, “Odisha remains focused on building a conducive ecosystem that promotes innovation, facilitates investments, creates job opportunities, and drives inclusive growth across industries.”
Ashwini Vaishnaw, Union Minister for Electronics and Information Technology, Railways, and Information and Broadcasting, said, “This initiative reflects India’s larger vision of strengthening domestic manufacturing capabilities and positioning the country as a global economic powerhouse.”
The Chief Minister of Odisha called the proposed investment a landmark moment for the state’s technology ambitions.
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