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    Samsung Leads $230 Mn Funding for European Chip Co EUCLYD Amid Memory Shortage

    Samsung Leads $230 Mn Funding for European Chip Co EUCLYD Amid Memory Shortage

    The Dutch semiconductor startup will use the funding to develop AI inference infrastructure and prepare for commercial deployment.

    Samsung Leads $230 Mn Funding for European Chip Co EUCLYD Amid Memory Shortage
    Sanjana Gupta··Updated OCTOBER 18, 2026, 8:58 PM
    5 min

    Netherlands-based semiconductor company EUCLYD has raised more than €200 million ($230 million) in a Series A financing round. Samsung Electronics, Somerset Capital Partners, EQT’s Scaleup Europe Fund, and Innovation Industries co-led the round. 

    It also saw participation from EIFO, imec.xpand, Brabant Development Agency, and Quadri.

    EUCLYD will use the funding to expand its engineering team and accelerate its silicon and systems roadmap, the company said in a statement. It is developing infrastructure for AI inference, focusing on reducing power use and computing costs. 

    Former ASML President and CEO Peter Wennink will also join EUCLYD as chairman of its board.

    The startup was founded by Bernardo Kastrup and Atul Sinha at High Tech Campus Eindhoven. It is developing computing, memory, and data centre systems for foundation AI models.

    EUCLYD said rising AI capabilities are driving up demand for power, memory bandwidth, and computing capacity. Its platform aims to address these infrastructure constraints and reduce the cost of running AI models.

    The company’s roadmap includes craftwerk, its AI silicon platform, and craftwerk station CWS, an AI data centre system. The platform combines programmable chips with memory and system-level optimisation.

    EUCLYD said the approach aims to address memory and efficiency constraints affecting AI performance and scalability. The company also plans to build partnerships across the semiconductor and data centre ecosystem.

    “AI is becoming a foundation of economic growth, scientific discovery, and national competitiveness,” Kastrup said in a statement. He added that AI infrastructure needs greater efficiency and lower costs to support wider adoption.

    Samsung also highlighted infrastructure efficiency as a key factor in the next phase of AI development. “The next phase of AI will be defined not only by model innovation, but also by the efficiency and scalability of its infrastructure,” said Dode Goldschmidt, Senior VP of Samsung Electronics.

    EQT said EUCLYD combines semiconductor expertise with a focus on AI infrastructure constraints. The company plans to use the new capital to expand its engineering organisation and accelerate product development.

    The financing will also support EUCLYD’s preparations for commercial deployment across enterprise, sovereign and hyperscale AI markets.

    Wennink added that Europe has capabilities across semiconductors, advanced manufacturing, and systems engineering. He said EUCLYD could turn those capabilities into an AI infrastructure platform.

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